| Paper Title
| Details
| Get PDF
|
| Alloy and Core-Shell Silver/Palladium Platelets for Ultra-Low Fire MLCCs | | |
| Conductive and Electroactive Polyanilines with Unique Tunable Work Functions | | |
| Conductive and Electroactive Polyanilines with Unique Tunable Work Functions | | |
| Suppression of Low-Frequency Dispersion in TiO2 Sintered Capacitor by Doping Ti Metal | | |
| Removal of Contaminants into Formation Tank with Ion Exchange Resins | | |
| Low-permitivity and high-Q ceramics, 2MgO-SintenSeki, at microwave frequency region | | |
| Evaluation of Improved CVD Nickel Powders for Thin Electrode MLCC | | |
| Development of Second Generation, Pb Free, Ultra Low Fire (< 1000C), High Voltage, X7(8)R Dielectric Formulations | | |
| Design Trends and New Challenges for Advanced Implantable Medical Devices | | |
| Dielectric Aluminum Oxides: Nano-Structural Features and Composites | | |
| The Effect of Fiber Thickness and Thickness Uniformity on CV/g Behavior of Ta Ribbon Type Fibers | | |
| Facedown Terminations Improve Ripple Current Capability | | |
| Metallized Polypropylene Film Energy Storage Capacitors For Low Pulse Duty | | |
| I, Robot - A Method for Flexible, Consistent Manufacturing of Capacitors | | |
| Reliability and Critical Applications of Tantalum Capacitors | | |
| Flexure Robust Capacitors | | |
| High Energy Density Polymer Dielectrics for Capacitor Applications | | |
| Polycarbonate Capacitors Yesterday, Today and Tomorrow | | |
| Ripple Current and Electrical Noise Characterization of DC BUS Capacitors for Future Power Electronics | | |
| New Low Profile Low ESL Tantalum Multi-anode Capacitor Concept Brings Better Cost versus Performance Value | | |
| High CV BME C0G | | |
| Precision Laser Trimmable Passives | | |
| The Effect of Silver Polymer Termination on the Equivalent Series Resistance of High Voltage Ceramic Capacitors | | |
| Capacitors for Reduced Microphonics and Sound Emission | | |
| Decoupling Solutions | | |
| Thin Film RCL Filters | | |
| Aluminum Capacitor Anode Foils for Miniaturized Applications | | |
| Tantalum Capacitors Bring Micro-Miniaturisation to Electronic Devices | | |
| MLCC ESD characterization | | |
| Impact of Pad Design and Spacing on AC Breakdown Performance | | |
| Tantalum Chip for Mission Critical Applications - The Development of Established Reliability Versions of Low ESR and Failsafe Technologies | | |
| Effect of Temperature Cycling and Exposure to Extreme Temperatures on Reliability of Solid Tantalum Capacitors | | |
| Infrared Flash Thermographic Location of a Short in a Solid Tantalum Capacitor | | |
| Hysteresis Measurements of Multi-Layer Ceramic Capacitors Using a Sawyer-Tower Circuit | | |
| Thick Film Resistors Testing by Electro-Ultrasonic Spectroscopy | | |
| Voltage Breakdown Mechanisms in High Voltage Rated, Surface Mount MLCCs | | |
| Niobium Oxide and Tantalum Capacitors: Leakage Current and M-I-S Model Parameters | | |
| Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry | | |
| Determining Ripple Current Capability in Tantalum Hybrid Capacitors | | |
| Multilayer Aluminum Oxynitride Capacitors for Higher Energy Density, Wide Temperature Applications | | |
| New RF Passive Discrete and Integrated Technologies Combining Ultra-Stable Performance and Smallest Size | | |
| Addressing Tantalum Capacitor Technology Challenges | | |
| Thin Film MLCC | | |